A. Parameters ye kɛ̈n ye kɛ̈n ye kɛ̈n ye kɛ̈n ye kɛ̈n ye kɛ̈n ye kɛ̈n ye kɛ̈n ye

1, Max load: 5kN

2, tɛmɛ: 0.5%

3, ɣän lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu lëu

4A tɛ̈ɛ̈r tɛ̈ɛ̈r tɛ̈ɛ̈r tɛ̈ɛ̈r tɛ̈ɛ̈r tɛ̈ɛ̈r tɛ̈ɛ̈r: 370mm

5，Resolution of test force: maximum load of 500,000 yards; ye kë ye cɔl "test force resolution": ye kë ye cɔl "maximum load" ye cɔl "maximum load" ye cɔl "maximum load" ye cɔl "maximum load" ye cɔl "maximum load" ye cɔl "maximum load" ye cɔl "maximum load" ye cɔl "maximum load" ye cɔl "maximum load". Ha yɔrɔ wala ha yɔrɔ wala ha yɔrɔ wala ha yɔrɔ wala ha yɔrɔ wala ha yɔrɔ wala ha yɔrɔ wala ha yɔrɔ wala ha yɔrɔ wala ha yɔrɔ wala ha yɔrɔ

6, Shift measurement accuracy: within ±0.5% of the displayed value

7, deformation measurement accuracy: within ±0.5% of the displayed value

8, Ajuiɛɛr de luɔɔi de luɔɔi: 0.005-5% FS/S

9, deformation rate adjustment range: 0.005-5%FS/S

10, test bench lifting device: quick/slow speed control, can click to move;

11Tɛɛr: 0.001-500mm/min

12, test bench security device: electronic limit position protection (gël de gël de gël de gël de gël de gël de gël de gël de gël de gël de gël de gël de gël de gël de gël de gël de gël)

13, gël tënë koom dɔ̈ŋ: gël tënë koom dɔ̈ŋ në 10%

14, Resolution of test force: 1/300000

15, Shift: Converter 2000 P/R, Resolution 0.003 mm

16, Power: 220V 50HZ;

17, ye tɛmɛ ye tɛmɛ ye tɛmɛ ye tɛmɛ ye tɛmɛ ye tɛmɛ ye tɛmɛ ye tɛmɛ ye tɛmɛ ye tɛmɛ ye tɛmɛ

18, deformation measurement range: 1 ~ 100% FS;

19, force control rate adjustment range: 0.005 ~ 5% FS/S; ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc

20, force control rate relative error: ±1% within the set value; 20, force control rate relative error: ±1% within the set value; 20, force control rate relative error: ±1% within the set value;

II. Pull Tester Machine Basic Function Introduction

1, ye load displacement curve; Load, time curve; Shift, time curve; Stress, deformation curve. (Kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye)

2, tɛ̈n yenë bɛ̈ɛ̈i kɔ̈k wïc bɛ̈ɛ̈i kɔ̈k wïc bɛ̈ɛ̈i kɔ̈k wïc bɛ̈ɛ̈i kɔ̈k wïc bɛ̈ɛ̈i kɔ̈k

3, ka tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛ A tɔŋ formula editing function, a lëu bɛ curves juëc ye tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ.

4, a lëu bï ya tɔ̈ɔ̈u decimal point number, each physical quantity unit and password protection etc.

5, Automatic Zero: Kompyuta bɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ

6, Automatic Return: Automatic Identification Test Maximum Strength, Activity Cross Beam Automatic High Speed Return to the First Position; 6, Automatic Return: Automatic Identification Test Maximum Strength, Activity Cross Beam Automatic High Speed Return to the First Position;

7, automatic archiving: test data and test conditions automatic storage disk, stop data loss caused by sudden power failure forgetting the storage disk; 7, automatic archiving: test data and test conditions automatic storage disk, stop data loss caused by sudden power failure forgetting the storage disk; 7, automatic archiving: test data and test conditions automatic storage disk, stop data loss caused by

8, test process: test process and measurement, display, analysis etc. are done by microcomputer. 8, test process: test process and measurement, display, analysis etc. are done by microcomputer. 8, test process: test process and measurement, display, analysis etc. are done by microcomputer.

9, tɛ̈n ye nyuɔɔth: data ku curves ye nyuɔɔth në tɛ̈n ye tɛ̈n ye tɛ̈n ye tɛ̈n ye tɛ̈n ye tɛ̈n ye tɛ̈n

10, structure reproduction: test results can be accessed freely, can be analyzed again on the data curve. 10, structure reproduction: test results can be accessed freely, can be analyzed again on the data curve. 10, structure reproduction: test results can be accessed freely, can be analyzed again on the data curve.